The reported figure would mark one of the latest corporate bond offerings as the company looks to fund its spending on artificial intelligence infrastructure build out. The Amazon Web Services parent is marketing United States high-grade bonds in as many as 11 tranches, according to a regulatory filing with the SEC. Amazon did not immediately respond to a Reuters request for comment.
The company’s deal is the latest in a string of massive bond issuances by hyperscalers, as they prepare to invest hundreds of billions of dollars in AI infrastructure. Investor appetite for high-grade corporate debt has remained strong, with large technology issuers drawing significant attention as investors seek relatively safe yields. Bond markets have been receptive to jumbo offerings this year, particularly from cash-rich hyperscalers looking to fund their long-term AI and cloud infrastructure ambitions.
–Reuters–
